NTAG213 Passive Label Circle Chip Blank NFC Sticker
Ultralight based tickets are ideal for low-cost, high-volume applications such as public transport, loyalty cards and event ticketing, serving as the perfect contactless replacement for magnetic stripe or barcode, addressing the trend of switching entire systems to purely contactless solutions. The introduction of the contactless Ultralight ICs for limited-use applications leads to reduced system installation and maintenance costs. Ultralight products can easily be integrated into existing schemes and even standard paper ticket vending equipment can be easily upgraded.
| Material |
PET/Paper |
Dimensions |
30*40mm |
| Working Temperature |
-20°C-75°C |
Storage Temperature |
-13°F to 158°F |
| Iternational standard |
ISO/IEC 14443A |
| Chip Type |
Ultralight |
| Memory |
144 Bytes |
| Frequency |
13.56MHz |
Reading Range |
1-10cm(depends on the reader or phone model) |
| Data Storage |
> 10 years |
| Re-write |
100,000 times |
| Installation |
Adhesive |
| Customization |
Printing, URL encoding, Serial numbers ,Web links, Design, etc |
Features
Fully compliant with the international standard ISO/IEC 14443A
Data transfer of 106 Kbit/s
True anti-collision
Field programmable 'Read only' locking function per page
Up to 100.000 single write operations
Future-proof evolution path and roadmap - standard interface ensures that today's infrastructure can easily be upgraded for future card ICs
Consistent product portfolio and multiple sourcing at all levels of the value chain
About us: Shenzhen A.N.G Technology CO., Ltd located in Shenzhen, is a high-tech manufacturer specialized in production Radio Frequency Identification Smart Card, NFC Label and Card Reader.
1. Wide Range Products Item
2. Better Price With High Quality And Professional Package.
3. Be Specialized In RFID Tag, NFC Tag And Smart Card For Long Time.
4. Customize Products Depending On Different Project From Customers.
5. Professional Designer, Experienced Salesman And Workers.
6. Advanced Production Experience and Professional R&D Capability.
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