ISO18000 Passive UHF RFID Tag Label for Asset Tracking

• Customization: Available
• Certification: RoHS, ISO, CE
• Shape: Square
• Model NO.: AL-P17412
• Chip Type: Read/Write
• Power Supply Mode: Passive
• Usage: Electronic Products
• Material: Paper
• Keywords: UHF RFID Tag Label
• Chip: Alien H3
• Reading Range: 1~5m
• Application: Asset Tracking
• Transport Package: Plastic Bags with Carton Outer Box
• Specification: 45*45mm
• Trademark: ANG
• Origin: Made in China
• HS Code: 8523521000
• Production Capacity: 100, 000 Pieces Per Month

Product Description

ISO18000 Passive UHF RFID Tag Label For Asset Tracking

RFID labels are carefully crafted with the highest quality label materials and RFID antennas. RFID labels are becoming a standard part of the retail chain and are also being used in security applications, baggage tracking, pharmaceuticals, retail medical devices and healthcare products.

Specification:

Tag Size should be:40*40mm or customized
Chip: Higgs3,Higgis4,M4,M4QT,M5 or customized
Frequency : 860 MHz (860-960 MHz)
Protocol: ISO18000-6C, EPC GEN 2
Conduct Material: Aluminum Etching
Substrate: PET of 50um thickness
Tamper proof antenna option : Aluminum etching technology,Copper etching technology,Silver Printing Technology
 

Operation Frequency	860~960Mhz
Reading range	about 0.01~6m  (vary from different reader and environment)
Chip Model	Alien Higgs 3
user Memory	512 Bits
Antenna Material	Aluminum etching antenna
Process	Flip chip

Features of Label:

** Customized development and production of RFID labels on rolls based on all RFID chips conventionally used in the marketplace, as well as customized antennas and inlay combinations
** Process monitoring, analysis and product development based on customer requirements and a neutral approach to technology
** User-specific RFID label development, tests and standards-based testing in in-house laboratory
Solutions specifically tailored to the respective application combining the RFID label, RFID printer and RFID dispensing system
** Labels tailored to challenging substrates such as metal, ESD, carbon fiber, glass or harsh ambient conditions such as heat or cold