Soi Wafer Silicon on Insulator Semiconductor Wafer

• Application: Industry
• Conductivity Type: N-Type
• Purity: SoG-Si
• Type: Polycrystalline Silicon
• Device Thickness: 2-300 Um
• Tolerance: +/-0.5 Um-2 Um
• Model NO.: ANG-SOI 01
• Resistivity: 0.001-100000 Ohm-Cm
• Dopant: 500A-4 Um
• Transport Package: Single Wafer in 100 Grade Cleaning Box
• Specification: 2/3/4/6/8/12 inch
• Trademark: ANG
• Origin: Guangdong, China
• HS Code: 8541900000
• Production Capacity: 50, 000PCS Per Month

Product Description

SOI Wafer Silicon On Insulator Semiconductor Wafer
 

SOI Wafer (Silicon On Insulator) 

* SOI Wafer sizes from 3" to 200mm, some in inventory
* Very high quality with tight TTV on device layer thickness
* Direct Si-Si bonding and double sided SOI available
* Any Si orientation, any device thickness over 1.5um
* Single and double side polished
* Small lot sizes and Laser marking of wafers available
* Short lead time delivery
 

TYPES OF SOI WAFER

Customizability is a major cornerstone of We and we always try our best to meet all your needs. In that very essence
We offers SOI wafers of the following types:
Thick SOI Wafer
This type of wafer has device thickness from 1µm to 300µm.
Ultra-Thin SOI Wafer
This type of wafer has device thickness <500nm.
Ultra-Uniform SOI Wafer
Uniformity of device thickness can be as low as ±0.5µm for thick SOI and ±10nm for ultra-thin SOI.
Ultra-Flat SOI Wafer
This type of SOI has very low BOW/WARP/TTV for specific applications.

SOI wafers are offered with great customizability and the parameters are greatly flexible as per your needs.

PRODUCT PICTURE

PACKAGING